作业帮求英文翻译（不要用工具）能熟练掌握模拟电路,数字电路,并熟练运用Cadence,Protel等画图及仿真软件,并了解KEIL等开发软件.能独立完成项目的硬件开发,熟悉硬件开发流程,在项目设计的过程中
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求英文翻译（不要用工具）能熟练掌握模拟电路,数字电路,并熟练运用Cadence,Protel等画图及仿真软件,并了解KEIL等开发软件.能独立完成项目的硬件开发,熟悉硬件开发流程,在项目设计的过程中
求英文翻译（不要用工具）
能熟练掌握模拟电路,数字电路,并熟练运用Cadence,Protel等画图及仿真软件,并了解KEIL等开发软件.
能独立完成项目的硬件开发,熟悉硬件开发流程,在项目设计的过程中与结构工程师,软件工程师合作,充分考虑到整体的配合.
能够指导PCB工程师完成PCB开发任务,熟悉PCB布局布线的要求,并充分考虑到信号完整性问题及可制造性问题.
能解决在调试工程中遇到的问题,并分析总结教训.
能解决硬件集成测试中所遇到的问题,如温升,高低温,静电,浪涌,EMI问题.尤其产品EMC方面有一定的研究,经过努力得到解决.
能够做到产品发布后续生产跟踪,反馈的问题得以改善,力求产品质量过硬.
请帮我翻得顺一点
求英文翻译（不要用工具）能熟练掌握模拟电路,数字电路,并熟练运用Cadence,Protel等画图及仿真软件,并了解KEIL等开发软件.能独立完成项目的硬件开发,熟悉硬件开发流程,在项目设计的过程中
Questions added: can familiar with analog circuit, digital circuit. and skillfully use Cad ence, Protel and other drawing and simul ation software. and understand the KEIL s oftware. etc. Can independently accompli sh hardware development of the project. f amiliar with hardware development proc esses. in the process of project design and structural engineers, software engineers c ooperate. cooperate fully consider the ov erall. Can complete the PCB PCB engineer s development task, familiar with PCB lay out requirements. and fully considering th e signal integrity problems and manufactu rability problems. Can solve the problems in debugging engineering, analysis and les sons learned. Solves the problem of hard ware integration testing. such as temperat ure rise. high and low temperature. esd. s urge. EMI problems. Especially product E MC research to a certain extent. resolved through efforts. Can released the follow-u p production tracking, feedback the probl ems to improve. strive for quality products.